A Review on the Development of Microscale Heat Transfer Enhancement Technique in Miniature Heat Sink

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Manish Kumar Mohit, Rajesh Gupta


Different features have been added in course of system improvement which should be energy efficient, and these technologies
made the system more efficient like it has become smaller in size, easy to transport, more convenient, and more effective. In
their micro-scale inter-component fields, extremely miniaturized and embedded electronic systems frequently emit a
significant amount of heat that, under some conditions, can contribute to the functional failure of the micro-device. This is the
main reason for the improvement in the system such that the heat should be eliminated by providing some improved features
in the system. Geometry improvement and working media alteration are used in the passive category, where heat transfer
performance enhancement is mainly focused, and the characteristics which play the primary role in this phenomenon are
discussed. Nusselt number and friction factor are an example of these characteristics which is responsible for fluid flow
behavior and heat transferability of the system. There are several methods but in this article, the acoustic wave technique and
pulsating inlet flow are considered for the active form of performance enhancement technique, which has recently been less
studied. In general, the increase in heat transfer performance is improved by the addition of disrupted thermal boundary layers
on fluid mixing.

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